International Standard Industrial Classification of All Economic Activities, Rev.4Central Product Classification Version 2.1
ISIC Rev 4 2610 to CPC v2.1
Crosswalk mapping from ISIC Rev 4 2610 "Manufacture of electronic components and boards" to CPC v2.1. 16 official equivalences.
ISIC Rev 4 2610 in CPC v2.1
Each entry is an official equivalence edge. Click to see the full CPC v2.1 definition, hierarchy, and its own crosswalks.
- 45281partialSound, video, network and similar cards for automatic data processing machines
- 46215partialConnectors for optical fibres, optical fibre bundles or cables
- 47110partialElectrical capacitors
- 47120partialElectrical resistors (except heating resistors)
- 47130partialPrinted circuits
- 47140partialThermionic, cold cathode or photo-cathode valves and tubes (including cathode ray tubes)
- 47150partialDiodes, transistors and similar semi-conductor devices; photosensitive semi-conductor devices; light emitting diodes; mounted piezo-electric crystals
- 47160partialElectronic integrated circuits
- 47171partialParts for the goods of subclass 47110
- 47172partialParts for the goods of subclass 47120
- 47173partialParts for the goods of subclasses 47140 to 47160
- 47223partialOther telephone sets and apparatus for transmission or reception of voice, images or other data, including apparatus for communication in a wired or wireless network (such as a local or wide area network)
- 47920partialSmart cards
- 48315partialLiquid crystal devices n.e.c.; lasers, except laser diodes; other optical appliances and instruments n.e.c.
- 48354partialParts and accessories for the goods of subclass 48315
- 88741partialElectronic component and board manufacturing services
Reverse direction: CPC v2.1 to ISIC Rev 4
About ISIC Rev 4 2610
2610 Manufacture of electronic components and boardsThe ISIC Rev.4 code 2610 includes establishments that produce electronic components such as semiconductors, printed circuit boards and other assemblies, using processes like etching, plating and soldering. Activities cover manufacturing of integrated circuits, passive components and board fabrication for use in consumer, industrial and communications equipment.