dsc_pkgLevel 1

Advanced Semiconductor Packaging

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dsc_pkg_2d52.5D Packaging (interposer, CoWoS, EMIB chiplets)

dsc_pkg_3d3D IC Stacking (HBM, die stacking, face-to-face)

dsc_pkg_chipletChiplet and Multi-Die Module Architecture

Cross-system equivalences1

NAICS 2022

3344Semiconductor and Other Electronic Component Manufacturingbroad

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